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TECHNOLOGY SOLUTIONS

SMT Assembly Roadmap

Item Conditions Current By End of 2018
Min Board Thickness 0.06mm 0.05mm
Max. Board Size Set Size: mm 250*300mm 250*350mm
Chip component (L,C,R etc) Minimum Size 01005 01005
Connector 0.4mm Pitch yes yes
0.35mm Pitch yes yes
High Density Component: TSOP,QFP,QFN,LGA, BGA etc 0.4mm Pitch yes yes
0.35mm Pitch yes yes
Reflow N2 Reflow Q3 2017 yes
Underfill Fill under Chip Auto Auto
Inspection Component position, direction, missing, etc. Auto AOI Auto AOI
Solder paste Online SPI Online SPI
thickness msmt
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