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Rigid-Flex Roadmap II

Rigid-Flex PCB Item Current By End of 2018
Pad Size, drill (min; um) Outer / Inner D + 200 D + 150um
Pad Size, laser (min; um) Capture / Target D + 175/200 D + 125/150um
Solder mask Registration tolerance +/- 50 +/- 30
Dielectric thickness, flex (min um) 300 250
Dam( um) 100 75
EMI Registration tolerance +-/125 +-/100
Touched Ground (min um) 1000 1000
Ground to Bending area (min um) 2000 2000
EMI Edge to Ground edge (EMI on Rigid Section) 500 500um
EMI Edge to RF-Line (EMI on Flex Section) 400 400um
Rigid and Flex section step height (EMI on Rigid Section) 350 350um
Rigid and Flex section step height (EMI on Flex Section) 500 500um
Dimension Tolerance Rigid outline to rigid outline 100 100um
Flex outline to flex outline 50 50um
Rigid outline to flex outline 150 150um
Rigid outline to rigid fid 150 150um
Flex outline to rigid fid 200 200um
Fid to Fid and Hole to Hole 75 50um
Rigid outline to RF-Line 200 200um
Electrical Test (um) Smallest SMT Pitch 250 150
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