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TECHNOLOGY SOLUTIONS

Rigid-Flex Roadmap I

Rigid-Flex PCB Item Current By End of 2018
General Flex Layer Count 2F Up to 4F
Rigid Layer Count Up to 10 Up to 12
Panel Rigid-Flex Panel Size 500 x 370mm 500 x 530mm
Dielectric thickness, flex (min um) 25 12
Dielectric thickness, rigid (min um) 43 35
Line / Space (um) Inner or NonPlated Layer 50 / 50 / 12 35 / 35 / 12
(L / S / Cu thk) 55 / 55 / 18 40 / 40 / 18
Outer or Plated layer 60 / 60 / 25 50 / 50 / 25
(L / S / Cu thk MAX) 63 / 63 / 35 55 / 55 / 35
Metal Edge to outline (min um) 200 150
Impedance NonPlated layer 10% 10%
Plated layer 10% 10%
Via Hole Size, drill (min; um) Rigid section < 0.8mm thk 100 150um
Flex section < 0.8mm thk 150 100um
Rigid section 0.8-2.0mm thk 250 200um
Hole to RF-Line (min um) 600 400
Hole Edge to Hole Edge (min um) 250 250
Via Hole Size, laser (min; um) Flex section < 50um 75 60um
Rigid section < 50um 75 63um
Rigid section 50-80um 100 75um
Via Edge to Via Edge (min um) 100 100um
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