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TECHNOLOGY SOLUTIONS
TECHNOLOGY SOLUTIONS

Rigid Roadmap

Rigid PCB Item Current By End of 2018
General Flex Layer Count 4L Up to 10L
Panel Rigid Panel Size 500 x 370mm 500 x 530mm
Dielectric thickness, rigid (min um) 43 35
Line / Space (um) Inner or NonPlated Layer 50 / 50 / 12 35 / 35 / 12
(L / S / Cu thk) 55 / 55 / 18 40 / 40 / 18
Outer or Plated layer 60 / 60 / 25 50 / 50 / 25
(L / S / Cu thk MAX) 63 / 63 / 35 55 / 55 / 35
Impedance NonPlated layer 10% 10%
Plated layer 10% 10%
Via Hole Size, drill (min; um) Thickness< 0.8mm 200 150um
Thickness< 0.8-2.0mm 250 200um
Via Hole Size, laser (min; um) Dielectric thickness< 50um 75 63um
Dielectric thickness< 50-80um 100 75um
Pad Size, drill (min; um) Outer / Inner D + 200 D + 150um
Pad Size, laser (min; um) Capture / Target D + 175 / 200 D + 125 / 150um
Solder mask Registration tolerance +/- 50 +/- 30
Under cut (min um) 38 25
Dam (um) 100 75
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