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TECHNOLOGY SOLUTIONS
TECHNOLOGY SOLUTIONS

FPC Roadmap

FLEXIBLE PCB Item Current By End of 2018
General Flex Layer Count 4 6
Roll Width/Panel Size (mm) Roll Width (Inner Layer) 250mm 250/500mm
Max. Production Panel Size 250x400mm 500x530mm
Line / Space (Min; um) Inner or NonPlated layer 45 / 45 / 12 40 / 40 / 12
(L / S / Cu thk) 45 / 45 / 18 40 / 40 / 18
Outer or Plated layer 45 / 45 / Max25 40 / 40 / Max25
(L / S / Cu thk) 60 / 60 / 20-35 55 / 55 / 25-35
Impedance NonPlated layer 10% 10%
Plated layer 12% 12%
Via Size (Min; um) Laser blind via 75 63
Stacked microvias Yes Yes
Laser through via 100 75
Mechanical through via 100 100
Pad Size (Min; um) Outer or Plated Layer D + 200 D + 175
Inner or NonPlated Layer D + 225 D + 200
Button Plated D + 250 D + 200
Coverlayer Registration (um) +/-125 +/-100
Solder mask Registration (um) +/-50 +/-37.5
Dam (um) 100 75
Electrical Test SMT Pitch Conventional (Min; um) 200 150
Flying Probe (Min; um) 200 150
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